COB implementation technology
We respond to a variety of needs, focusing on the implementation of electronic components, including those equipped with bare chips.
Our company's "COB implementation technology" focuses on the mass production line for the mounting and assembly of electronic components, primarily using bare chips. "COB" refers to a high-density circuit board that directly mounts IC chips onto substrates, enabling the miniaturization and thinness of devices. We offer a comprehensive range of services from component procurement to substrate mounting, finished product assembly, and inspection, utilizing a wide array of implementation technologies such as wire bonding, die bonding, thick film printing, and lead-free/eutectic soldering. 【COB Manufacturing Line】 1) Wafer dicing 2) Die bonding 3) Wire bonding 4) Automatic mounting of SMD components 5) Electrical characteristic testing *For more details, please refer to the PDF document or feel free to contact us.
- Company：光山電気工業 拡販推進
- Price：Other
