We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for COB mounting technology.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

COB mounting technology - List of Manufacturers, Suppliers, Companies and Products

COB mounting technology Product List

1～2 item / All 2 items

Displayed results
COB implementation technology

COB implementation technology

We respond to a variety of needs, focusing on the implementation of electronic components, including those equipped with bare chips.

Our company's "COB implementation technology" focuses on the mass production line for the mounting and assembly of electronic components, primarily using bare chips. "COB" refers to a high-density circuit board that directly mounts IC chips onto substrates, enabling the miniaturization and thinness of devices. We offer a comprehensive range of services from component procurement to substrate mounting, finished product assembly, and inspection, utilizing a wide array of implementation technologies such as wire bonding, die bonding, thick film printing, and lead-free/eutectic soldering. 【COB Manufacturing Line】 1) Wafer dicing 2) Die bonding 3) Wire bonding 4) Automatic mounting of SMD components 5) Electrical characteristic testing *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • ASIC
  • Dedicated IC

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
【Technical Introduction】COB Process

【Technical Introduction】COB Process

Miniaturization of modules is possible! Semiconductor chips can be directly mounted on printed circuit boards using die bonding material!

We would like to introduce the COB process technology of Niigata Seimitsu Co., Ltd. The COB process can accommodate implementations such as a pad pitch of 0.07mm and a die size of □0.5mm. Additionally, we can comprehensively handle other processes related to the COB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Directly mounting semiconductor chips (ICs) onto printed circuit boards (PCBs) using die bonding material ■ A method of connecting the electrodes on the IC side to the electrodes on the PCB side using gold wire ■ Smaller mounting area compared to SMT methods, enabling miniaturization on the PCB ■ Implementation combined with SMT is also possible ■ Miniaturization of modules is achievable *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Circuit board processing machine
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.